On April 26, Wingtech presented a report (Draft) on the issue of shares and payment of cash to purchase assets and raise supporting funds. The report disclosed the supporting financing plans over 5.8 billion CNY in detail, of which, the advanced sealing plus testing platform with the process upgrading project and the 4G / 5G semiconductor communication module sealing plus testing with terminal from R & D to industrialization project in Cloud Silicon Intellegent Vally are particularly eye-catching. This means that Wingtech has increased the investment in Nexperia while introduced its advanced sealing technology and high-power MOSFET products into China. It would be a significance to Wingtech performance. Furthermore, to promote the whole level of Chinese semiconductor industry.

Nexperia is a leading expert in the high-volume production of essential semiconductors, components that are required by every electronic design in the world. The company’s extensive portfolio includes diodes, bipolar transistors, ESD protection devices, MOSFETs, GaN FETs and analog & logic ICs. With an annual output over 69 billion pieces per year, the company is the largest small signal semiconductor device packaging base in the world. It has a cutting-edge packaging technology, a massive production experience, a perfect technological process, the vehicle regulation level and the efficient cost-effective control system. Nowadays, the 5G communication industrialization has been promoted constantly, of all kinds of intelligent terminal products appeared as the same time. This will be a tremendous demand for standard device semiconductors in the future. Nexperia will take the ownership of distribution in the capacity of sealing and testing, and make forward-looking strategic reserves for potential customer.

The 4G / 5G semiconductor communication module sealing test and terminal R&D and industrialization project of Cloud Silicon Intelligent Technology Town，which will build a large-scale intelligent manufacturing center integrating R&D, design, production and manufacturing with the help of the technology and R&D capabilities from Wingtech and Nexperia. Eventually, to form an annual Production capacity of 24 million 4G / 5G communication modules and intelligent terminals.

Wingtech has been working in the ODM industry for several years with a deep understanding of communication chip products. In April 2019, Wingtech launched the first 5G communication solution based on the Qualcomm SD x55 platform. Nexperia has the production capacity of standard devices in the electronic application field and the industry-leading sealing technology. Wingtech and Nexperia have cooperated and launched successfully the vehicle communication module products based on 4G. Relying on the advanced semiconductor sealing technology of Nexperia and the quality control ability of vehicle specification level, the 4G communication module of vehicle specification level can be widely used in automobile electronics, notebook computer, router, intelligent speaker, AI / VR, 5G CPE (home gateway), IoT and other intelligent terminals. Based on the gradual promotion of 5G commercialization and the constant R & D capability and t R & D platform of Wingtech and Nexperia, it will continue to evolve 4G to 5G communication technology, and innovate packaging forms, the high integration, miniaturization and low cost of communication modules and intelligent terminals will become true. In this way to improve the overall performance and market competitiveness. This fund-raising investment project will benefit Nexperia who bring the technology to China. The in-depth promotion of M & A integration of Wingtech and Nexperia will act in a positive synergy effect.

On April 21, Wingtech published its 2019 Annual Report. Benefiting from the strong growth of communication and semiconductor business, the company turned a revenue of CNY 41.578 billion, increased 139.85% compared with last year. The net profit attributable to shareholders of listed companies was CNY 1.254 billion, increased 1954.37%. The cash flow of operating activities showed CNY 4.62 billion, increased 41.2%. This announcement introduces the LFPAK advanced packaging product line of high-power MOSFET, will carry on the automation transformation to the existing semiconductor seal test intelligent manufactures. It also invests in the semiconductor communication module seal test and terminal research and development and industrialization project, which is expected to greatly improve the seal test capacity, production efficiency and industry status of Nexperia, which is comprehensively improve the profitability and development space of Wingtech. As the only Chinese semiconductor company who can compete with European and American semiconductor giants at present, the future of Wingtech is worth looking forward to.

Origin: Quanjing Web

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